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Public Funding Projects

Collaborative approach to value creation. Advanced nanotechnology collaboration projects where innovation meets precision.

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Collaborative Projects

Exploring Advanced Nanotechnology Collaborations

Explore our projects to discover how ATLANT 3D is driving innovation, enhancing manufacturing capabilities, and fostering sustainable and smart solutions for a better future.

Our portfolio features groundbreaking work in advanced manufacturing of microelectronics, supported by EU Commission, EU Chip Act, European Space Agency, and others. Each project reflects our commitment to pushing the boundaries of atomic-layer printing, micro-optoelectronics, and smart sensors.

From developing cutting-edge machinery for hybrid technologies in the MESOMORPH project to pioneering atomic layer processing in the Gap4DALP initiative, we are actively shaping the future of nanofabrication. Our projects like WISE and ARI Hub demonstrate our dedication to revolutionizing product complexity and contributing to the semiconductor industry’s growth.

Project

MESOMORPH

Funding

EU Horizon 2020

Status

Running

Start Date

October 2020

Budget

10m EUR

Partners

Prima Industrie Spa (Coordinator); Scuola Universitaria Professionale Della Svizzera Italiana; Iris Srl; Uab Femtika; Opi Photonics Srl; Morphica Societa A Responsabilita Limitata; Friedrich-alexander-universitaet Erlangen Nuernberg; Politecnico Di Torino; Stmicroelectronics Srl; Smolsys Ltd.; Heliotis Ag; Mch-tronics Sagl​.

Scope

Developing an all-in-one machine for hybrid technologies to enable high value-added multi-scale integrated micro-optoelectronics. It aims to overcome challenges in micromanufacturing processes, enhance throughput and productivity, and foster innovation in microsystems with a new business model​​.

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Project

ESA BIC & ESA Idea

Funding

ESA BIC

Status

Running

Start Date

June 2023

Budget

130k EUR

Scope

Building the 2nd generation of Nanofabricator 0g. The project focuses on various design and testing phases, including norms review, gas system design, and laboratory testing in simulated ISS environments​​.

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Project

ATOSENS

Funding

M-ERA.NET IFD

Status

Running

Start Date

June 2023

Budget

980k EUR

Partners

Institute of Electrical Engineering Slovak Academy of Sciences (IEE SAS) (coordinator), National Yang Ming Chiao Tung University, Comenius University Bratislava.

Scope

Exploring atomic-layer 3D printing for smart sensors. This project focuses on developing TiO2-based hydrogen sensing elements and a smart hydrogen sensor with in-sensor data processing​.

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Project

Gap4DALP

Funding

Eurostars IDF

Status

Running

Start Date

November 2023

Budget

1.5m EUR

Partners

Danish Fundamental Metrology A/S (DNK); Avantes b.v. (NLD)​.

Scope

Developing a breakthrough Direct Atomic Layer Processing (DALP) technology for precise advanced manufacturing. The project aims to revolutionize the micro/nanofabrication sector with a cost-effective, fast, and environmentally friendly all-in-one fabrication machine​​.

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Project

WISE

Funding

EU Horizon

Status

Upcoming

Start Date

Q1 2024

Budget

5.57m EUR

Partners

Prima Additive Srl (Coordinator), Iris Srl; Amplitude; Alite Srl; Morphica Srl; Idryma Technologias Kai Erevnas; Foto-katalytika Nano Ylika I.k.e.; Politecnico Di Torino; Hogskolan Vast; Gkn Aerospace Sweden Ab; Neos Surgery Sl; Hydro Alps; Scuola Universitaria Professionale Della Svizzera Italiana; Femtoprint Sa; Mch-tronics Sagl​.

Scope

Creating a multi-scale, multi-process machine for high value-added products with disruptive functionalities. WISE focuses on integrating advanced AI engineering and manufacturing techniques to produce complex multifunctional products in various sectors​​.

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Project

Pack4EU

Funding

EU Chip Act

Status

Running

Start Date

July 2023

Budget

999k EUR

Partners

BLU Morpho, Semi, TU Delft, High Tech NL, VDI-VDE-IT, EPoSS, imaps, CEA +43 associated partners​.

Scope

Aiming to federate the European Packaging Industry and enhance supply chain resilience. The project includes analysis of the supply and demand sides for advanced packaging solutions and skill development​.

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Project

Advanced Packaging for RF Modules

Funding

ESA

Status

Running

Start Date

Jan 2024

Budget

400k EUR

Partners

Thales Alenia Space (TAS) (coordinator), UMS​.

Scope

Addressing key themes in the space economy, such as climate change, security, and telecoms. The project will develop advanced packaging technologies and a new concept for high integration, high thermal, and RF performance modules​​.

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Project

ARI HUB

Funding

USA Chip Act

Status

Running

Start Date

2023

Budget

52B EUR

Partners

100+

Scope

Supporting the Silicon Heartland Microelectronics Commons Hub. This involves participating in innovation sessions and helping develop plans for research and development in the semiconductor industry​​.

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OUR ACHIEVEMENTS

Completed Projects

ATOPLOT

EU H2020

2020-2022

2.98M EUR

Rapid atomic layer 3D printer for microelectronics

InnoBooster

2021-2023

1.545M DKK

ATLANT 3D Atomic Layer Nanoprinter for rapid micro- and nanoprototyping of complex multi-material 2D/3D structures with high-resolution

EU H2020 SME1

2019

75k EUR

ATLANT 3D – the first 3D printer for micro and nanofabrication, handling 450+ materials

InnoBooster

2019

488,325 DKK

ATLANT 3D – the first 3D printer for micro and nanofabrication, handling 450+ materials

InnoFounder

2019

215k EUR

AWARDS & RECOGNITION
FORBES MEMBER
HELLO TOMORROW GRAND WINNER 2021
EIT POWER UP WINNER 2019
FORMNEXT WINNER 2021
RED HERRING WINNER
3D PIONEERS CHALLENGE WINNER
FALLING WALLS WINNER 2020
ITC GOLD WINNER 2021
ROYAL SOCIETY OF CHEMISTRY FINALIST 2020
GIS IN CHINA WINNER 2019
WINNER STARTUP CONTEST 2021
ADMACOM WINNER 2019
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