ATLANT 3D Collaborates on Breakthrough Project to Simplify and Greenify Chip Production
Copenhagen, Denmark – June 10, 2025 – ATLANT 3D, a leading provider of direct-write atomic layer advanced manufacturing solutions, announces its participation in a major European R&D project titled Photo-Atomic Layer Printing (PhotoPrint). The initiative is funded under a European collaboration and aims to drastically simplify the semiconductor manufacturing process using an innovative, maskless technique based on structured UV light.
The 36-month PhotoPrint project officially launched on May 1, 2025 and is coordinated by Aalto University (Finland), in partnership with:
• Institute of Electrical Engineering, Slovak Academy of Sciences (IEE SAS) – Slovakia
• ATLANT 3D Nanosystems ApS – Denmark
• Ghent University – Belgium (Associated Partner)
• Lund University – Sweden (Associated Partner)
The total project budget is €1,075,220, with ATLANT 3D receiving €300,000 to contribute its unique capabilities in atomic layer advanced manufacturing and direct-write technologies.
A single-step, digital breakthrough for a greener semiconductor future
Current semiconductor production methods are costly, complex, and environmentally unsustainable. Traditional photolithography demands multiple steps, cleanroom conditions, and large volumes of hazardous chemicals. PhotoPrint introduces a paradigm shift by replacing this legacy approach with a single-step, maskless, and digital process: direct printing of thin-film patterns using structured UV light.
The process enables precise control over material placement and film thickness at the micrometer scale, unlocking new design freedom for emerging technologies such as neuromorphic computing and in-sensor electronics. By eliminating hazardous substances and reducing chemical and material waste, PhotoPrint promotes a more sustainable, scalable, and adaptable manufacturing approach.
ATLANT 3D’s role and impact
As a pioneer in atomic layer advanced manufacturing, ATLANT 3D will support the integration of selective material deposition and thin-film patterning processes. The company’s patented Direct Atomic Layer Processing (DALP®) technology will complement the consortium’s efforts to demonstrate functional neuromorphic devices fabricated via the PhotoPrint method.
“We’re excited to contribute our platform to a project that aligns so well with our mission—enabling agile, sustainable, and precise manufacturing of advanced electronics,” said Dr. Maksym Plakhotnyuk, CEO of ATLANT 3D. “PhotoPrint has the potential to transform how microdevices are made, and we’re proud to be part of this European innovation effort.”
The PhotoPrint project is expected to deliver key demonstrators and proofs of concept by 2028, with strong implications for the future of edge computing, sensor integration, and beyond.
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