We are excited to announce the launch of the CERMETAD (Ceramic Embedded Metamaterials for Microwave Application Devices) project, funded through the prestigious M-ERA.NET Call 2023. This collaborative effort brings together leading research and industry partners: Fraunhofer IKTS (Germany), IRCER (France), DTU (Denmark), and ATLANT 3D (Denmark). The project aims to push the boundaries of wireless communication technologies by developing innovative solutions for controlling electromagnetic waves. The main objective of CERMETAD is to create reconfigurable intelligent surfaces (RIS), a crucial component for future 5G and 6G wireless communication networks. These programmable surfaces will be designed using advanced metamaterials, enabling precise control of electromagnetic waves. By integrating phase-changing materials such as vanadium dioxide and germanium-antimony-tellurium, the project seeks to develop surfaces that can dynamically optimize the reflection and transmission of signals, addressing the challenges of communication frequencies.
In addition to the development of RIS, CERMETAD will explore new ceramic-based packaging technologies that ensure the durability, scalability, and reliability of the devices, making them suitable for high-performance applications in industries such as telecommunications, automotive, aerospace, and beyond. The project also aims to demonstrate the potential of these innovations for applications in radar sensing and imaging, opening new possibilities for precision sensing and smart environments.
Through a combination of scientific research, materials engineering, and advanced manufacturing techniques, CERMETAD is expected to generate valuable knowledge in wave-matter interactions and contribute significantly to the future of wireless communication technologies.
Learn more about the project and partners here.
The R&D project is financed by the funding authorities of the individual member states
About ATLANT 3D
ATLANT 3D specializes in atomically precise advanced manufacturing of microelectronics and nanoelectronics. The company’s proprietary DALP® technology offers precise material deposition, essential for emerging applications. ATLANT 3D is committed to advancing microelectronics through innovative solutions that provide zero waste, flexibility in innovation, and compatibility with semiconductor industry standards.
For more information, please visit https://www.atlant3d.com
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ATLANT 3D is part of CERMETAD research project Information
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