Connect with our team to explore how DALP® technology can advance your research and development.
DALP® transforms how we build advanced materials and devices Seamless integration of metals, semiconductors, Seamless integration of metals, semiconductors, Seamless integration of metals, semiconductors, Advanced device manufacturing has historically relied on photolithography, requiring multiple sequential steps across different facilities. Each stage – from material deposition to patterning to etching – demands specialized equipment and clean room environments. This approach, while precise, creates inherent limitations in developing next-generation devices, particularly when working with novel material combinations or complex geometries. Our Direct Atomic Layer Processing technology represents a fundamental shift in manufacturing methodology. By integrating temporal and spatial atomic layer processing into a single system, we’ve created a direct digital approach to material assembly. The proprietary microchemical reactor enables precise control over molecular deposition while eliminating the need for traditional photomasks and multiple process steps. Direct patterning of multiple materials in a single step Digital monitoring of atomic-scale assembly Targeted deposition minimizing material waste Uniform coating of complex structures, including 90° walls At the core of our technology lies a proprietary microchemical reactor, Think of it as the world’s most sophisticated molecular assembly system, where precursor gases are precisely choreographed to create complex structures. Our system works with hundreds of materials, from metals and semiconductors to complex oxides. Download our comprehensive materials guide to explore the full spectrum of possibilities. See DALP® technology in action through our gallery of electron microscopy Metal Oxide variable shapes Metal Oxide variable shapes Metal electrodes on glass Metal electrodes on Si Gradient on glass Gradient on glass
Mastering Matter at the Atomic Scale:
DALP® Technology
Beyond Traditional Boundaries
Direct-Write Control
and oxides
Multi-Material
and oxides
Next-Gen Applications
and oxides
A New Chapter in Manufacturing
Traditional Manufacturing
Constraints
DALP® Technology
Advancement
Material Integration
Process Control
Resource Efficiency
Geometric Freedom
Orchestrating Atoms:
The Heart of DALP®
an innovation that transforms atomic layer deposition.
Material Mastery
Download Material Guide
Built by Scientists,
Validated by Scientists
images and performance data.
and gradients on glass
and gradients on Si
