DALP® can deposit multiple materials sequentially in the same chamber to create multilayer structures in a single process step. This capability allows researchers to design prototypes atom by atom, enabling direct patterning and complex designs with arbitrary shapes, with excellent uniformity on complex geometries and sensitive substrates.

This user case shows how multi-material device prototypes can be easily developed and rapidly deposited with just one machine.

THE PROBLEM

• Prototyping of new device designs requires sequential material deposition, patterning, and removal
• Doing so with multiple materials only multiplies the number of steps and thereby duration and cost

OUR SOLUTION

• Each material can be directly patterned sequentially, by simply aligning and stacking the required shapes
• Material switching can be done quickly and easily, so there is no need for intermittent processes or removing the sample
• The deposition path is controlled digitally so there is great flexibility in design, and making localized variations in e.g. thickness is particularly easy with DALP

THE RESULTS

Above: Material and sensor examples:

a)TiO2 and ZnO electrochemical sensors

b)Pt micro-heater

c)Pt-only sensor

d)Reactive TiO2 surface sensor

e)MIM capacitor

Multimaterial devices Information

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