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Precision Meets
Progress, Atom by Atom.

Key Application Areas

Material Research & Development

Move directly from design to functional prototype in one step. Build complexdevices like gas sensors and MIM capacitors without multiple machines or process steps. Test different material combinations and structures rapidly to optimize device performance.

Advanced Device Prototyping

Move directly from design to functional prototype in one step. Build complexdevices like gas sensors and MIM capacitors without multiple machines or process steps. Test different material combinations and structures rapidly to optimize device performance.

Next-Generation Electronics

Move directly from design to functional prototype in one step. Build complexdevices like gas sensors and MIM capacitors without multiple machines or process steps. Test different material combinations and structures rapidly to optimize device performance.

DALP® Technology: Precise Control
at the Atomic Scale

How it Works

Our Direct Atomic Layer Processing technology uses proprietary microchemical reactors to deposit materials exactly where needed, building complex structures one atomic layer at a time. Think of it as 3D printing at the atomic scale—precise, controlled, and capable of creating structures that were previously impossible to manufacture.

Why its Better

Unlike traditional fabrication methods that require multiple steps, masks, and cleanrooms, DALP® technology directly prints materials atom by atom. This means you can:

  • Create complex multi-material structures in a single step
  • Build precise gradients down to 0.3 nanometers
  • Work with hundreds of materials including metals, semiconductors, and oxides
  • Achieve uniform coatings even on challenging 90° angles and deep cavities

Us vs Them

Traditional Method

2-week process
Multiple machines
Complex clean room setup
Limited material combinations
Fixed patterns

DALP® Technology

1-day process
Single tool
Benchtop operation
Multi-material capabilities
Dynamic, adjustable designs

Main Benefits Grid

Precision

  • 0.3 nm step height
  • Multi-material capability
  • Atomic-level control

Speed

  • Weeks to days
  • Rapid prototyping
  • Quick iteration cycles

Flexibility

  • Hundreds of materials
  • Multiple substrates
  • Complex geometries

Efficiency

  • No cleanroom needed
  • 90% less waste
  • Lower operating costs

Technical
Specifications Highlight

  • Atomic-level design

Create multilayer structures atom by atom in a single process step.

  • Complex geometry mastery

Uniform coatings on 90° walls, deep cavities (up to 60 microns),
and intricate nanostructures.

  • Novel devices

Fabricate advanced devices like Bragg mirrors, MIM capacitors,
and vertical interconnections.

Download Technical Overview

Ready to Turn Months of Research into Days?

Interested in learning more? View detailed specifications
and features of the Nanofabricator™ Lite. Let’s discuss how Nanofabricator® Lite can support your unique research goals

Download NFL Specifications
Schedule a Demo

Nik Thorsen

Business Development Manager
[email protected]

Nik Thorsen