Overcome Traditional Fabrication Barriers
RF & Printed Electronics
Overcome Traditional Fabrication Barriers
The RF and printed electronics industry faces significant challenges: complex multi-step processes, limited material compatibility, and difficulty achieving precise patterns on non-planar surfaces. These obstacles delay innovation and increase costs. Our atomic-scale fabrication technology creates new possibilities by enabling direct patterning of conductive and dielectric materials with unprecedented precision—transforming weeks of work into days while maintaining complete control at the atomic level.
Capabilities That Transform Development Cycles
Build Complex Structures With Atomic Precision
- Create multi-layer electronic components in single processing steps
- Achieve conformal deposition on challenging surfaces (up to 60 µm deep)
- Control material properties through precise thickness management
- Develop structures traditional fabrication methods can’t achieve
Accelerate From Concept to Working Prototype
- Variable process speed from 0.1 mm/s to 100 mm/s for optimal results
- Temperature flexibility from room temperature to 300°C
- Path-defined processing for targeted material deposition
- Sequential multi-material processing for complex electronic stacks
Design With Unprecedented Material Freedom
- Work across 450+ compatible materials without cross-contamination
- Create precise electrical and material property gradients
- Selective nanoparticle deposition for specialized applications
- Develop custom hollow structures for advanced RF components
Your Material Palette for RF & Printed Electronics
Conductors & Semiconductors
- Platinum (Pt): High-performance contacts and mirrors
- Zinc Oxide (ZnO): Versatile semiconductor for optoelectronics
- Iridium (Ir): Premium conductor for specialized applications
- Copper Oxide (CuO): Efficient material for photovoltaic applications
- Tin Oxide (SnO2): Gas sensors
- transparent electrodes
- solar cells
Dielectrics & Specialized Materials
- Aluminum Oxide: The ultimate barrier against degradation
- Titanium Dioxide: Where stability meets functionality
- Zinc Oxide: Engineering interfaces at the atomic level
- Tin Oxide: Sensing and conducting with remarkable balance
- Vanadium Pentoxide: Storage capacity that exceeds expectations
Build on Your Foundation of Choice
- Silicon wafers
- Silicon Carbide (SiC)
- Gallium Nitride (GaN)
- Glass substrates
- Fused silica
- Borosilicate materials
- Flexible polymers
Applications That Define Tomorrow’s Electronics
- High-frequency filters with unprecedented Q factors
- Flexible printed circuit elements for wearable technologies
- Integrated passive devices with reduced parasitic effects
- Advanced antenna structures with selective material distribution
- Specialty sensors with atomic-level material control
See Atomic-Scale Precision in Action
Speak with our application specialists to discuss your specific RF and printed electronics development challenges.
