Change the rules for semiconductor device designers with DALP®
Unleashing Innovation in Semiconductor Technology
DALP® (Direct Atomic Layer Processing) is transforming the semiconductor industry by dramatically accelerating the transition from ideas to prototypes. This innovative technology enables the creation of complex shapes and material applications previously considered unattainable, by allowing for rapid testing and material exploration.
Standard deposition techniques typically coat entire substrates, requiring additional etch steps to remove unwanted material. ATLANT 3D’s proprietary Direct Atomic Layer Processing (DALP®) offers a transformative alternative. By employing a microreactor to directly deposit thin films atom by atom, DALP® enables maskless, localized coating precisely where needed
Electrochemical glucose sensors measure glucose levels in biological fluids by converting the biochemical reaction of glucose oxidation into an electrical signal. They are vital in diabetes management, allowing patients to monitor blood glucose conveniently.
Revolutionize your microfabrication processes with ATLANT 3D’s “Chip Surgery” using our pioneering DALP® technology. Discover how we are transforming microfabrication by enabling precise, rapid repairs during the deposition process, drastically reducing downtime and resource waste.
ATLANT 3D’s latest innovation allows for platinum deposition without a reactant, offering greater flexibility and efficiency in thin film deposition processes. Our technology enhances flexibility, reduces material costs, and speeds up the deposition process, making it a valuable tool for research and development in advanced materials.
Direct-Patterning SnO2 Deposition by Atomic-Layer Additive Manufacturing
This study demonstrates the direct-patterning of SnO₂ thin films using atomic-layer additive manufacturing (ALAM), which integrates ALD-like surface chemistry with spatially controlled precursor delivery via a micro-nozzle for 3D-printed line deposition. The process yields uniform, amorphous SnO₂ lines that crystallize upon annealing, with optimal deposition at 200 °C, highlighting ALAM’s potential for eco-efficient microfabrication without lithography.
Authors: Sonja Stefanovic, Kikia Hashemizadeh, Mingjian Hu, Johannes Will, Ivan Kundrata, Erdmann Spiecker, Julien Bachmann
Direct-Patterning ZnO Deposition by Atomic-Layer Additive Manufacturing Using a Safe and Economical Precursor
Area-selective atomic layer deposition (AS-ALD) is a bottom-up nanofabrication method delivering single atoms from a molecular precursor. AS-ALD enables self-aligned fabrication and outperforms lithography in terms of cost, resistance, and equipment prerequisites, but it requires pre-patterned substrates and is limited by insufficient selectivity and finite choice of substrates.
Authors: Sonja Stefanovic, Negar Gheshlaghi, David Zanders, Ivan Kundrata, Baolin Zhao, Maïssa K. S. Barr, Marcus Halik, Anjana Devi, Julien Bachmann
Additive manufacturing in atomic layer processing mode
The invention of atomic-layer additive manufacturing (ALAM): In ALAM, controlled surface chemistry is performed with spatially constrained flows of molecular precursors delivered to the substrate from a microfluidic nozzle. Each pass of the nozzle over any point of the substrate deposits one monolayer of solid. Repeated passes allow for direct patterning deposition of functional materials with Angström vertical resolution.
Authors: Ivan Kundrata, Maïssa K. S. Barr, Sarah Tymek, Dirk Döhler, Boris Hudec, Philipp Brüner, Gabriel Vanko, Marian Precner, Tadahiro Yokosawa, Erdmann Spiecker, Maksym Plakhotnyuk, Karol Fröhlich, Julien Bachmann.
