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ATLANT 3D

DALP® TECHNOLOGY

First ever on-demand atomic layer advanced manufacturing technology based on hybrid Direct Atomic Layer Processing.

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Unique technology

REDEFINING MICROFABRICATION

We developed DALP® (Direct Atomic Layer Processing) patent-pending technology that provides highly conformal, direct material writing, and removal with atomic precision and material versatility.

It is suitable for a wide range of applications such as MEMS, devices, optics, photonics, packaging, RF & electronics and quantum devices which can be developed with ATLANT 3D technology with previously impossible functionality and speed at a fraction of a cost.

Advanced Microfabrication

Rapid, Precise, & Versatile Atomic Processing

ATLANT 3D’s Direct Atomic Layer Processing (DALP®) has revolutionized prototyping, turning a traditionally lengthy process into a rapid, precise operation. Key benefits include accelerated development cycles, atomic-level control for complex prototypes, versatile material and surface adaptability, and cost reductions due to increased efficiency. This advancement in DALP® fosters a conducive environment for innovative microdevice fabrication, marking a significant leap in microfabrication technology.

Innovation

+50%

Efficiency

10x

Materials

450+

DALP™

We developed DALP® (Direct Atomic Layer Processing) patent-pending technology that provides highly conformal, direct material writing, and removal with atomic precision and material versatility.

Paradigm-shifting technology

EVOLUTION OF ATOMIC LAYER PROCESSING

The evolution of Atomic Layer Processing has been marked by a significant transition, primarily spearheaded by ATLANT 3D’s innovative DALP® technology. This paradigm-shifting advancement redefines the precision and control achievable in thin-film deposition. By facilitating atomic-scale manipulation within the fabrication process, DALP® introduces an enhanced level of granularity and uniformity in material layering. This breakthrough is indicative of a broader trajectory within materials science, driving towards miniaturization and enabling the complex device architectures necessary for next-generation technologies.

First there was

TEMPORAL ALD

Sequential pulse sequence for precursor and co-reagent delivery. Time base separation of reagents.​

TALD is the traditional form of ALD, known for its sequential exposure of surface substrates to precursor vapors, each separated by an inert gas purge to prevent gas-phase reactions. TALD’s strength lies in its exceptional conformality and thickness control, making it ideal for high-quality thin-film coatings. However, TALD’s reliance on vacuum environments and time-consuming purge steps often results in slower deposition rates, which can be a limiting factor for large-scale and rapid manufacturing needs.

Then there was

SPATIAL ALD

Spatial separation of precursor and co-reagent with increased deposition speed. Physical distance separation of reagents.​

SALD, an evolutionary step from TALD, maintains the self-limiting surface reactions characteristic of ALD while enhancing throughput. By spatially separating the precursors, SALD systems deposit materials at atmospheric pressure, significantly increasing the deposition rate. SALD is adaptable to roll-to-roll processes, making it attractive for large-area coatings. Nevertheless, SALD’s dependency on sophisticated equipment to maintain precursor separation can complicate system design and scalability.

And now there is

DALP®

ATLANT 3D’s Direct Atomic Layer Processing (DALP®) technology represents a seminal breakthrough in the atomic layer deposition (ALD) arena. By ingeniously combining the meticulous precision of Temporal ALD (TALD) with the accelerated deposition rates characteristic of Spatial ALD (SALD), DALP® stands as a beacon of innovation, all while operating in ambient atmospheric conditions. This remarkable synthesis of speed and accuracy in DALP® is made possible through a distinctive microreactor design, which enables the direct application of precursor molecules onto the substrate, negating the need for vacuum environments that have long been a staple of ALD processes.

Exploring the Nozzle
Materials

ALD MATERIALS TESTED WITH DALP®

The Direct Atomic Layer Processing (DALP™) technology has been rigorously tested with a variety of Atomic Layer Deposition (ALD) materials. These materials have been chosen for their unique properties and applications in various high-tech industries.

The tested ALD materials with DALP® demonstrate the technology’s versatility and efficiency in handling diverse substances, ensuring precision and consistency in the deposition process. This extensive testing underscores DALP® potential in revolutionizing material processing in microfabrication and nanotechnology fields.

Titanium Dioxide

MATERIAL

TiO2 DALP® tested

Used for its photocatalytic properties and UV absorption, common in sensors and solar cells.

  • PREC.A: Ti(OiPr)4
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): 0.4
  • CHARACTERIZATION: IE, SEM, EDX, TEM, XPS, transistor
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Optical, Dielectric, Barrier, Protection
Zinc Oxide

MATERIAL

ZnO DALP® tested

Offers semiconducting, piezoelectric, and pyroelectric properties, ideal for electronic and optoelectronic devices.

  • PREC.A: Zn(dmap)2
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): 1.1
  • CHARACTERIZATION: IE, SEM, EDX, AFM, XRD, XPS, transistor
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Piezoelectric
Platinum

MATERIAL

Pt DALP® tested

A highly conductive and corrosion-resistant metal, often used in electronic components and catalytic applications.

  • PREC.A: (MeCp)PtMe3
  • PREC.B: O3
  • GROWTH RATE
(Å/PASS): 0.9
  • CHARACTERIZATION: IE, SEM, EDX, TEM, XRD, XPS, LEIS, R(T)
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Catalyst, Conductor
Aluminum Oxide

MATERIAL

Al2O3 DALP® tested

Known for its hardness and thermal stability, used in insulating layers and as a barrier material.

  • PREC.A: TMA
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): 0.4
  • CHARACTERIZATION: IE, SEM, EDX, TEM, XPS
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Dielectric, Barrier, Protection
Copper Oxide

MATERIAL

CuO DALP® tested

A p-type semiconductor with applications in batteries, solar cells, and gas sensors.

  • PREC.A: Cu(dmap)2
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): 0.06
  • CHARACTERIZATION: IE, SEM, EDX, XRD
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Can be converted to Cu
Iridium

MATERIAL

Ir DALP® tested

A highly dense and corrosion-resistant material, used in high-temperature and harsh environmental applications.

  • PREC.A: (EtCp)Ir(CHD)
  • PREC.B: O3
  • GROWTH RATE
(Å/PASS): –
  • CHARACTERIZATION: IE, SEM, EDX, XRD
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Conductor
Iridium Oxide

MATERIAL

IrO2 DALP™ tested

Known for its electrochemical stability, used in electrodes and corrosion-resistant coatings.

  • PREC.A: (EtCp)Ir(CHD)
  • PREC.B: O3
  • GROWTH RATE
(Å/PASS): –
  • CHARACTERIZATION: IE, SEM, EDX, XRD
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Catalyst
Hafnium Oxide

MATERIAL

HfO2 DALP® tested

Exhibits high dielectric constant and stability, used in semiconductor gate insulators and optical coatings.

  • PREC.A: Hf(NMe2)4
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): 1
  • CHARACTERIZATION: IE
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: Dielectric
Tin Oxide

MATERIAL

SnO2 DALP™ tested

Known for its electrochemical stability, used in electrodes and corrosion-resistant coatings.

  • PREC.A: TDMASn
  • PREC.B: H2O
  • GROWTH RATE
(Å/PASS): –
  • CHARACTERIZATION: –
  • FURTHER PROPERTIES KNOWN FROM ALD FILMS: –

The selected ALD materials, each with unique properties, affirm DALP’s applicability across multiple domains, including semiconductor manufacturing, energy storage, and nanoelectronics.

GAS DEPOSITION

ATLANT 3D’s technology involves the sequential deposition of gasses for atomically precise patterning of various materials.So far we tested with our technology the following materials: TiO2, Pt, ZnO, SiO2. And it is continuously updated.

MULTISTACK PRINTING

Our DALP™ technology allows to print conformally different materials, enabling:

  • High-quality multistack patterns and layers for complex devices
  • Cross-geometrical printing
  • Print resolution of 400 µm line width (25 µm in development)
  • Atomic monolayer (0.2 nm) vertical resolution

COMPLEX SURFACES

Our technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:

  • Nanostructure surfaces (nanopillar nanograss etc.)
  • Microfluidics channels and optical gratings
  • With surface roughness up to 20 μm*
  • Substrate materials can be adapted based upon customer requirements

Line Width

400 µm now, 25 µm in development, 1 µm long term goal

Temperature

Operates in a temperature range from room temperature (RT) up to 300°C

Process speed

Variable from 0.1 mm/s up to 100 mm/s (based on sample and process specifications)

Versatile Materials Platform

Possible to process several materials sequentially out of 450+ ALD materials possible.

Environment

Open atmospheric conditions or within controlled ambient environments

Hybrid processing

Direct additive and subtractive processing

Selective Area Deposition

Path-defined processing for targeted deposition of materials

Surface geometry

Conformal deposition on any type of surface with corrugation up to 60 µm

Multimaterial stack printing

Multiple materials can be deposited sequentially

Crystalline Material

Growth High quality material deposition

Selective nanoparticle deposition

Tested with platinum (Pt) processes

Hollow microstructuring

Post process hollow structure development

Learn more

Questions & Answers

Find insights into our Direct Layer Atomic Processing (DALP®) and other advanced technological developments. Here we explains our pioneering nanofabrication methods, their applications, and advantages in the realm of atomic-scale manufacturing.

Direct Atomic Layer Processing (DALP®) is a revolutionary technology pioneered by ATLANT 3D, marking a significant leap in the field of nanofabrication. It utilizes a unique microfluidic chemical reactor for selective area direct atomic layer processing, distinguishing itself from traditional methods by offering maskless flexibility and rapid prototyping capabilities. Capable of handling over 450 materials, DALP® is applicable in diverse sectors including MEMS & Sensors, Photonics, and RF & Microelectronics.

Key highlights of DALP® include its atomic-scale precision, multi-material deposition in a single process, and its adaptability to various substrate surfaces. This technology not only accelerates material innovation by facilitating rapid testing and development, but also integrates seamlessly into existing laboratory infrastructures. Additionally, DALP® supports environmental sustainability by minimizing waste and reducing reliance on harmful chemicals, making it a forward-thinking solution in advanced manufacturing.

DALP® is scalable for industrial applications, affirming its suitability for both research and large-scale production needs. ATLANT 3D provides extensive support for DALP® users, including technical assistance, training, and integration consultation, ensuring the effective application of this groundbreaking technology across various industries and research domains.

Traditional fabrication methods, like photolithography, often involve complex and resource-intensive processes. DALP®, on the other hand, offers a maskless, direct-write approach. This method enables rapid prototyping and production with unprecedented precision and flexibility, reducing time, cost, and resource dependencies significantly compared to conventional methods.

DALP® accelerates material innovation with rapid testing and process development capabilities, offering a broad spectrum of material experimentation, quicker innovation cycles, and reduced resource dependency.

DALP® is versatile in its material capabilities, handling over 450 different materials, including metals, dielectrics, and semiconductors. It is independent of surface roughness and substrate sensitivity, making it suitable for a wide range of applications in various industries.

ATLANT3D has tested various materials with DALP®, including Titanium Dioxide (TiO2), Platinum (Pt), Zinc Oxide (ZnO), and Silicon Dioxide (SiO2), showcasing its capacity to handle a wide range of materials from conductive to superconductors.

DALP® allows for direct material deposition, etching, doping, oxidations, passivation, and 3D structure growth, contributing to innovation in electronics, photonics, energy storage, and more.

The key advantages of DALP® include:

  • High precision at the atomic scale, allowing for intricate and accurate material deposition.
  • Flexibility in processing a vast range of materials.
  • Rapid prototyping capabilities, significantly reducing development timelines.
  • Energy-efficient processes, contributing to sustainability.
  • Scalability from research to industrial applications.

DALP® technology finds applications across various sectors, including:

  • MEMS & Sensors: For creating intricate sensor structures.
  • Optics, Photonics, and Novel Displays: In developing advanced optical components.
  • Advanced Packaging: For microelectronics and semiconductor industries.
  • RF Devices and Microelectronics: Enhancing the performance of RF components.
  • Emerging technologies in areas like quantum computing and biomedical devices.

Yes, DALP® is designed with sustainability in mind. It minimizes material wastage, requires less energy compared to traditional methods, and reduces the need for harmful chemicals and solvents, making it an environmentally friendly option in the advanced manufacturing sector.

Yes, DALP® technology is designed to be adaptable and can be integrated into existing manufacturing lines. Its compact and versatile nature allows for seamless integration with minimal disruption to current processes.

ATLANT 3D provides comprehensive support, including technical assistance, training, maintenance services, and consultation for integrating DALP® into specific industrial processes and research projects.

Yes, ATLANT 3D continuously updates and expands the list of materials compatible with DALP® technology. Ongoing R&D efforts aim to deepen and accelerate the understanding of the process, material, and equipment levels through advanced data analysis and the application of machine learning and artificial intelligence​​.