Empowering material innovation and prototyping with multi-material sequential deposition and unmatched sample versatility elevating industrial capabilities. Discover the power of advanced micro and nano-scale fabrication.
ATLANT 3D is a pioneering atomic-scale advanced manufacturing company that utilizes digital and atomically precise processing technologies to enable rapid innovation across the whole microelectronics value chain.
From advanced materials R&D, prototyping of micro and nanodevices, and scalable manufacturing to final applications in domains such as Optics, Photonics, MEMS/Sensors, Microfluidics, RF, and Printed Electronics.
ATLANT 3D offers unique capabilities across the value chain, flexibility in innovation and integration in scalable manufacturing, zero waste, and compatibility with semiconductor industry standards. We enable the first-ever complete cycle atomic scale advanced manufacturing in a network-centric innovation ecosystem on Earth and beyond.
DALP® Technology
Discover ATLANT 3D’s proprietary advanced atomic layer manufacturing technology, based on microreactor Direct Atomic Layer Processing (DALP®).
Precision in atomic-scale manufacturing
ATLANT 3D’s DALP® technology revolutionizes nanofabrication with atomic precision, enabling accurate material deposition vital for microelectronics and photonics.
DALP® technology’s versatility in processing over 450 materials, enables its use in sectors from semiconductor manufacturing to novel nanomaterials creation, offering unprecedented potential for innovation in material science and nanotechnology.
ATLANT 3D’s DALP® technology drives sustainability, reducing waste and harmful chemicals, whilst enhancing energy efficiency and aligning with global sustainable manufacturing goals, and showcasing our commitment to environmental care.
Discover the ultimate tool designed for academia and research, to fast-track advanced material innovation, process testing, and device development with unmatched atomic precision.
Experience the unprecedented flexibility & material versatility of NANOFABRICATOR™ LITE, making
it an essential asset for academic and research applications.
Our technology is specifically designed for advanced applications, introducing functionalities and processing speeds that were previously unattainable, whilst significantly reducing costs, R&D and production timelines.
MEMS and integrated sensors, microfluidics and Lab-on-Chip, RF-devices, optical and photonic devices, quantum & energy-harvesting and storage devices can be developed with ATLANT 3D technology.
We believe collaboration is one of the core elements of accelerating innovation, which is why we are proud to be working on projects with some of the world’s most exciting and leading entities.
Our portfolio features groundbreaking work in advanced manufacturing of microelectronics, supported
by EU Commission, EU Chip Act, European Space Agency ESA, and others.
Closer: circular raw materials for European Open Strategic autonomy on chips and microelectronics production
FUNDING Horizon Europe
STATUS Running
START DATE October 2024
BUDGET 14M EUR
Partners
Universita Degli Studi Di Roma Tor Vergata, Holland Circular Hotspot, VELTHA IVZW, Universita Degli Studi Della Tuscia, ERP Italia Servizi SRL, DUE2LAB S.R.L. (DUE2LAB), Circular Industries BV, SWEGAN AB, Leonardo – Societa Per Azioni, Selcom Group S.P.A., ForkBomb BV, Green Blue Modern Solutions PC, Interuniversitair Micro-ElectronicaCentrum (IMEC), Politecnico Di Milano, Clust-ER Meccatronica E Motoristica (CLUSTERMM), Associazione Fabbrica Intelligente Lombardia, Feragame, Lorusso Estrazione SRL, UAB Fivrec, Closing The Loop BV, R.A.I.T 88 SRL, Freiberger Compound Materials GmbH (Freiberger), Universita Telematica Pegaso S.R.L., Calabria Regione, Smart Photonics BV, Fraunhofer, World Business Council For Sustainable Development (WBCSD), Ruhr-Universitaet Bochum, Soltech, DockweilerChemicals GmbH
Scope
CLOSER is focused on establishing a European circular supply chain for semiconductor raw materials. The project addresses Europe’s critical dependence on external sources for strategic materials like silicon, gallium, indium, and germanium by reclaiming and repurposing these materials from e-waste and industrial waste. CLOSER aims to create a sustainable and resilient solution to support microelectronics production within Europe. Through innovative processes such as urban mining and advanced recycling methods, the project reduces reliance on raw material imports and supports the EU’s strategic autonomy in semiconductor manufacturing. This initiative is vital to industries such as automotive, aerospace, renewable energy, health, and computing.
ATLANT 3D contributes to the CLOSER project by leveraging our DALP technology to enable the precise and scalable deposition of recovered materials onto functional platforms. Technology plays a critical role in transforming reclaimed semiconductor raw materials into functional components for advanced microelectronics and ensuring their high purity and performance. ATLANT 3D’s expertise bridges the gap between material recovery and real-world industrial applications by facilitating the development of secondary semiconductor devices and supporting next-generation microfabrication solutions.
ACES: Advanced Contact Engineering and Surface Passivation for Solar Cells
FUNDING Horizon Europe
STATUS Running
START DATE April 2024
BUDGET 3.5M EUR
Partners
Danish Technical University (DTU), Swiss Center for Electronics and Microtechnology (CSEM), Aarhus University, Elplatek, Meyer Burger
Scope
ACES focuses on improving the performance and cost-effectiveness of silicon solar cells. The project addresses two critical challenges in the photovoltaic (PV) industry: replacing expensive silver with copper in solar cell metallization and developing a new technique for selective edge passivation. These advancements will enhance cell efficiency, reduce production costs, and accelerate the adoption of sustainable energy solutions.
ATLANT 3D contributes to ACES with our DALP technology. The DALP platform allows for the localized and selective deposition of materials at the atomic scale, making it ideal for creating narrow diffusion barriers and seed layers essential for copper metallization. In the project, ATLANT 3D develops and demonstrates the technology to deposit precision copper contacts and advanced dielectric materials for edge passivation, ensuring minimal recombination losses and maximum conductivity. By enabling localized, high-precision material deposition, ATLANT 3D’s solution overcomes the limitations of conventional silver screen-printing techniques and supports the transition to cost-effective, copper-based solar cells. This innovation not only improves solar cell efficiency but also addresses sustainability concerns by reducing reliance on rare and costly materials like silver.
AMUSENS: Adaptable multi-pixel gas sensor platform for a wide range of appliance and consumer market
FUNDING Horizon Europe
STATUS Running
START DATE June 2024
BUDGET 8M EUR
Partners
Luxembourg Institute of Science and Technology (LIST), TechnikonForschungs– UndPlanungsgesellschaft Mbh, Science for Change, Universite De Liege,Jlm InnovationGmbh,UniversitaDegli Studi Di Brescia,InstitutMines-Telecom,Sciosense GermanyGmbh, EllonaSas
Scope
AMUSENS aims to develop a new adaptable gas sensor platform and an innovative manufacturing method to meet the growing demand for low-cost, high-performance gas sensors in consumer and appliance markets. The project addresses the limitations of existing technologies by enabling the precise deposition of multiple sensing materials, improving selectivity and adaptability for a wide range of applications.
ATLANT 3D contributes to AMUSENS through our proprietaryDALP technology. This advanced method allows for localized, high-precision deposition of metal oxide sensing materials directly onto micro-hotplate platforms. By enabling on-demand material combinations, DALP technology supports the development of multi-material gas sensors with improved performance, efficiency, and scalability. ATLANT 3D plays a central role in demonstrating the feasibility of wafer-scale production for these multi-material devices, making it possible to bridge the gap between laboratory research and industrial-scale manufacturing.
CERMETAD
FUNDING M-ERA.NET
STATUS Running
START DATE June 2024
BUDGET 1.5M EUR
Partners
Fraunhofer IKTS (Germany), IRCER (France), DTU (Denmark), and ATLANT 3D (Denmark).
Scope
The project aims to push the boundaries of wireless communication technologies by developing innovative solutions for controlling electromagnetic waves. The main objective of CERMETAD is to create reconfigurable intelligent surfaces (RIS), a crucial component for future 5G and 6G wireless communication networks. These programmable surfaces will be designed using advanced metamaterials, enabling precise control of electromagnetic waves. By integrating phase-changing materials such as vanadium dioxide and germanium-antimony-tellurium, the project seeks to develop surfaces that can dynamically optimize the reflection and transmission of signals, addressing the challenges of communication frequencies.
InnoBooster: Multi-head DALP system for enhanced throughput
FUNDING Innovation Fund Denmark
STATUS Running
START DATE June 2024
BUDGET 1.5M EUR
Partners
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Scope
ATLANT 3Dpioneered Direct Atomic Layer Processing (DALP®) for micro-/nanofabrication, addressing current limitations of the field with cost efficiency, material diversity, and atomic-level resolution. Building on this success, ATLANT 3D seeks to develop a multi-head DALP® system to meet the industry’s need for greater throughput, enhancing efficiency and flexibility, reducing production costs, and meeting the rising demand for micro/nano-products in a dynamic market.
Building the 2nd generation of Nanofabricator 0g. The project focuses on various design and testing phases, including norms review, gas system design, and laboratory testing in simulated ISS environments.
Institute of Electrical Engineering Slovak Academy of Sciences (IEE SAS) (coordinator), National Yang Ming Chiao Tung University, Comenius University Bratislava.
Scope
Exploring atomic-layer 3D printing for smart sensors. This project focuses on developing TiO2-based hydrogen sensing elements and a smart hydrogen sensor with in-sensor data processing.
Danish Fundamental Metrology A/S (DNK); Avantes b.v. (NLD).
Scope
Developing a breakthrough Direct Atomic Layer Processing (DALP®) technology for precise advanced manufacturing. The project aims to revolutionize the micro/nanofabrication sector with a cost-effective, fast, and environmentally friendly all-in-one fabrication machine.
Prima Additive Srl (Coordinator), Iris Srl; Amplitude; Alite Srl; Morphica Srl; Idryma Technologias Kai Erevnas; Foto-katalytika Nano Ylika I.k.e.; Politecnico Di Torino; Hogskolan Vast; Gkn Aerospace Sweden Ab; Neos Surgery Sl; Hydro Alps; Scuola Universitaria Professionale Della Svizzera Italiana; Femtoprint Sa; Mch-tronics Sagl.
Scope
Creating a multi-scale, multi-process machine for high value-added products with disruptive functionalities. WISE focuses on integrating advanced AI engineering and manufacturing techniques to produce complex multifunctional products in various sectors.
Supporting the Silicon Heartland Microelectronics Commons Hub. This involves participating in innovation sessions and helping develop plans for research and development in the semiconductor industry.
Addressing key themes in the space economy, such as climate change, security, and telecoms. The project will develop advanced packaging technologies and a new concept for high integration, high thermal, and RF performance modules.
Establishing a DALP® Strategy for Rapid Prototyping in Photovoltaics
Join us for a deep dive into the future of photovoltaic innovation, where atomic-scale precision meets rapid prototyping. In this webinar, experts from academia and industry explore how Direct Atomic Layer Processing (DALP®) enables the design and fabrication of ultrathin, non-toxic, and earth-abundant solar cell stacks layer by layer, atom by atom.
Learn how this approach overcomes the speed and flexibility limits of conventional atomic layer deposition, opening new pathways for faster materials discovery, interface control, and next-generation solar technologies.
Speakers:
Dr. Julien Bachmann – Friedrich-Alexander University of Erlangen-Nürnberg
Micah Mc Naire – Friedrich-Alexander University of Erlangen-Nürnberg
